Get Advanced Thermal Management Materials PDF

By Guosheng Jiang

ISBN-10: 146141962X

ISBN-13: 9781461419624

ISBN-10: 1461419638

ISBN-13: 9781461419631

Advanced Thermal administration Materials offers a finished and hands-on treatise at the significance of thermal packaging in excessive functionality platforms. those structures, starting from lively electronically-scanned radar arrays to internet servers, require parts that could deplete warmth successfully. This calls for fabrics in a position to dissipating warmth and keeping compatibility with the packaging and dye. insurance comprises all elements of thermal administration fabrics, either conventional and non-traditional,with an emphasis on steel dependent fabrics. An in-depth dialogue of homes and production methods, and present purposes are supplied. additionally offered are a dialogue of the significance of fee, functionality and reliability matters while making implementation judgements, product existence cycle advancements, classes realized and destiny directions.

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High refractive index silicone rubber materials have become a priority in development and production. Polyimide can withstand temperatures of up to 350–450°C. It has good insulation, good dielectric properties, and good resistance to organic solvents and moisture. It has been widely used in the semiconductor and microelectronics industry. A polyimide layer is mainly used as a passivation layer, stress buffer, protective coating, interlayer dielectric material, or liquid crystal orientation film.

Electron Process Technol 22(6):238–241 13. CF Legzdins etal (1997) MMCX - An expert system for metal matrix composite selection and design. Can Metall Quart 36(3): 177–178 14. Liang G (2003) Actively develop domestic microelectronics packaging industry. China Electron Bus 13(6):86–88 15. Strand SD (2005) Future technology in the global market. Power Systems World, 23–27 Oct 2005 16. Markoff J (2004) Intel’s big shift after hitting technical wall, New York Times, 17 May 2004 17. Zweben C, Schmidt KA (1989) Advanced composite packaging materials.

3 Multilayer Substrate Integrated Circuits Currently, Al2O3 ceramic multilayer substrates are mostly used to improve the integration of 3 day ICs. Multilayer substrate technology takes the following three forms: 1. Thick-film printing multilayer On a sintered Al2O3 ceramic substrate, a multilayer is formed by laminating Au, Cu, and other conductive pastes with a low-dielectric paste. The multilayers are sintered in 850–900°C. This substrate is inexpensive, easy to replace, and easily forms the desired impedance.

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Advanced Thermal Management Materials by Guosheng Jiang


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